The FPA-6000 is a space-efficient, inherently stable,
tightly integrated and highly flexible single-stage scanning
platform that supports mass production on 300- and 200-millimeter
substrates down to the 45-nanometer node.
With the fastest synchronized wafer stage scanning (500
mm/second), stepping (1000 mm/sec) and reticle scanning
speed (2000 mm/sec) in the industry, the 6000 Platform
enables patterning 300-mm wafers at the rate of 140wph—and
170wph for 200mm.
Even at these remarkable speeds, the Canon FPA-6000 platform
achieves overlay accuracy sufficient for 65nm. In the
FPA-6000 series scanning platform, the imaging optics
and the body are an inseparable system. The reticle and
wafer stages are counter-balanced to eliminate scanning
forces before they produce vibrations.