Large field 2:1 lens. The FPA-3000MR can expose a 50mm-square
area in one shot. In addition to its wide field size,
it has an air-bearing X-Y stage and a high-speed reticle
changer for throughput capability above 100 wph on 6-in.
substrates.
High compatibility with resist process. With high resolution
and depth of focus, plus a job-linked sigma variable feature
to achieve optimum illumination, ensure high productivity
over a wide range of resist process.
High precision alignment system. The FPA-3000MR alignment
system provides two Off Axis methods to reduce the effect
of resist coverage and increase process margin. It also
has an option mark function for processes in which alignment
marks are difficult to form.