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INTRINSIF BIREFRINGENCE IN CaF2:


Is it a showstopper for 157nm lithography?

Articles
“157nm technology- A worldwide work in progress” - International SEMATECH reviews the work underway on all fronts—device makers, equipment and material suppliers, consortia, research institutes and universities—and hands out the "157nm Report Card" (September, 2001). Plus a comprehensive look at the problem of birefringence.

"Getting to be #1 in the Lithography marketplace- Answers from the top" - An interview with Mr. Fujio Mitarai, president and chief executive officer of Canon Inc., regarding his announcement that Canon is aiming to become #1 in all its core business markets by 2005, with particular emphasis on capturing worldwide semiconductor lithography market leadership—a position Canon already holds in Japan and Europe.

"Beyond the Gold Medal" "Dr. Optics" addresses the apparently unending need for new lens designs, new adjustment methods, and new measurement tools to control of aberrations as the industry continues to "raise the bar." The article examines attaining High Strehl Intensity.

"FPA-5500iZ- Wide-field I-line stepper for 300mm." This i-line stepper has a lot in common with Canon’s newest KrF and ArF scanners—beginning with the same wide field size (26 x 33mm). Also, the FPA-5500iZ uses the high-speed wafer stage and enhanced vibration control. A product data sheet.

"Sources for focus errors"
Focus errors arise from many sources, both random and systematic. This tutorial instructs on careful analysis of all possible focus error sources in a process.

"The Global Suppliers Forum"
The Global Suppliers Forum is SEMI’s initiative to organize the influence and voice of the semiconductor supplier community. Canon, assuming a role in this new program, invited Stanley Myers, SEMI's President and CEO, to outline the purposes and design of the GSF.

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Fall 2001
Volume 6, Issue 3

LITHOGRAPHY AT THE CROSSROADS:


How Far Can Optics Go- 90nm with KrF?

Articles
"Commitment to Lead…Resources to Succeed" Two important principles
–both unique among litho tool vendors–guide Canon's response to semiconductor equipment marketing. First, having corporate revenues from other sources to sustain the development of IC fabrication technology during times of industry reversal. Second, having a broad incentive to continue to invest heavily in microlithography, as an ultra-technology that contributes directly to Canon's core competency of advanced imaging.

"350mm/s Scan Speed—the Industry's Fastest" This report details the overlay accuracy, focus/leveling control repeatability, synchronization accuracy and MSD values achieved by the Canon FPA-5000ES3 Scanner platform—all at incredibly high retical and wafer stage velocities.

"Achieving Small Aberrations" Using cross sections of the optical system as examples, Dr. Optics (also known as Canon's Dr. Akiyoshi Suzuki) discusses methods used by optical designers to minimize or suppress aberrations.

"GRATEFUL: Resolving Dense 100nm L/S Features with KrF" A synopsis of work by MIT Lincoln Laboratories, Numerical Technologies, Photronics and Arch Chemicals to address the issues of proximity control in strong phase-shift lithography. GRATEFUL is "Gratings for Regular Arrays and Trim Exposures for ULSI Lithography."

"How Can CD Control Be Improved?" In this continuation, Chris Mack examines the root causes of CD error and discusses several equations necessary for understanding them—as steps to choosing both the right process settings and the right equipment and materials.

"Canon's 6000 Series F2 Scanner Platform" The first published report on the new, very fast, space-efficient, single-stage scanning platform Canon will use for its next family of KrF, ArF and F2 tools. Extensive discussion of the counter-motion linear motors that eliminate vibration before it happens, within the stage itself, and how this allows scanning at much faster rates than competitive units.

"Number One in Five Years" A thorough, step-by-step examination of the ambitious goal stated by the president of Canon Inc., Fujio Mitarai, as part of his five-year plan to achieve top share in all of Canon's major business areas—including semiconductor equipment. Q&A style.

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Summer 2001
Volume 6, Issue 2


OPTICAL KNOW HOW


Extending the Limits

Articles

"Lithography Strategy for the 130nm Technology Node and Beyond" Canon's roadmap for volume production optical exposure tools into the 130nm/100nm era. Plus updates on its programs in F2, EUV and maskless lithography for technology nodes below 100nm

"157nm System Development Enters the Mainstream" Discusses optical and platform design criteria, including three projection optics design options Canon is evaluating for the full-field, high NA, 157nm beta tool (FS1) it plans to deliver in 2003. Plus an overview of Canon's involvement with others to develop a comprehensive solution for the entire 157nm lithography infrastructure and to prove its feasibility.

"Chromatic Aberration" This "Ask Dr. Optics" feature briefly surveys the present status of the optical materials suitable for lithography use and considers the optical characteristics of each, by technology node. Concludes with discussion of the severe constraints imposed at the 157nm (F2) node. Several charts on materials performance for i-line, KrF, ArF and F2.

"The SCAA Mask and Phase Phirst!" Dr. Marc D. Levenson, with others, describes and explains the significance of the Sidewall Chrome Alternating Aperature mask and the Phase Phirst! paradigm that exploits it for the benefit of ASIC and SOC device makers who can accept having all fine lines at predefined phase-shift grid locations.

"Why is CD Control Important?" Noting that CD control and overlay control are independent operations in most fabs today, Chris Mack examines the less apparent ways in which CD control affects device performance, and the specific manner of influence upon the particular device layer being printed.

"Roadmap…or Roadgap?" Phillip M. Ware, Canon Senior Fellow, Lithography Strategy, muses on the implications the ITRS 2000 update will have for the industry—and on why or how soon it will be necessary to leave KrF. Q&A format.

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Spring 2001
Volume 6, Issue 1

 

 
 
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