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CURRENT ACTIVITIES
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Over the next few years IC device makers will shift from 130nm to 90nm for volume production and 65nm for R&D. Technology no longer will follow the traditional 3-year memory cycle, but will be dictated by a 2-year logic driven roadmap. As the primary enabling technology, lithography must continue to lead the way. |
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With NGL solutions still next generation optical lithography will be forced to extend to at least 45nm. Canon's current activities are focused on delivering lithography solutions for sub 100nm imaging through 45nm. It is with this purpose that Canon built it's new platform - the FPA-6000. |
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The FPA-6000 is Canon's latest scanner specifically designed to be extendable to the 45nm node. It supports 248nm, 193nm, and 157nm exposure wavelengths and delivers an industry leading 140-300mm wph. Vibration canceling wafer and reticle stage designs ensure precise image resolution and control. |
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Beyond simply building a tool, Canon is becoming increasingly involved in strategic partnerships and joint development activities. These partnerships cover a wide range of collaboration including advanced resist development, new metrology solutions, developing lithography process modules for sub 90nm imaging, 157nm partnerships and NGL related activities in EUV and Maskless. |
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Canon is well positioned to help the industry and our customers advance down this new roadmap. Our new 6000 platform is capable of delivering processing capabilities through 45nm, which according to today's ITRS roadmap, tools will be required by 2005 for early R&D with 2007 for production -- timing Canon is well on track to achieve. |
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