Web Content Viewer

Actions

NC8000 MRAM Etch

Etch

  • Large diameter grid for good uniformity and high productivity
  • Clamp-free wafer stage allows wafer rotation during process and adjust wafer angle with ion beam
  • Optical End Point Detection System (OES) for precise control over etching process

This is to make Misc appear on the page when needed.

  • System configuration: Cluster type
  • Substrate: Φ300 mm

This is to make Misc appear on the page when needed.

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

 Return to Top