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FPA-3030EX6 Stepper

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Features

FPA-3030EX6 is compatible with a variety of special substrates

  • FPA-3030EX6 steppers accommodates small-sized substrates with diameters of 200 mm or less

  • FPA-3030EX6 steppers are capable of handling a variety of substrate thicknesses and materials including silicon, sapphire, silicon carbide and glass

  • FPA-3030EX6 steppers share the same wafer feeding system as the FPA-3030i5+ i-line stepper (released in June 2012) that has built a proven track record handling special and small-sized substrates

FPA-3030EX6 is a high performance KrF excimer laser stepper

  • FPA-3030EX6 steppers deliver the highest levels of resolution, overlay accuracy and productivity (throughput) among KrF excimer laser steppers in the same class*

  • FPA-3030EX6 steppers provide 150 nm imaging resolution, 25 nm overlay accuracy and 121 wafers per hour throughput**

FPA-3030EX6 IS compatible with FPA-3000EX6 reticle and recipes

  • FPA-3030EX6 steppers can use the same reticles as the FPA-3000EX6, making possible the effective utilization of existing equipment and assets

  • FPA-3000EX6 stepper recipe files can be imported and applied to the new FPA-3030EX6 steppers, easing process development challenges

* As of July 4, 2016, based on a Canon survey

** 200mm wafer, 60 shots

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Specifications

Model Type

KrF (248 nm) DUV Stepper

Wafer Size

200 mm; 150 mm; 125 mm; 100 mm

Resolution

≤ 150 nm

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio

5:1

Field Size

22 mm x 22 mm

Overlay Accuracy

≤25 nm (|m| + 3σ)

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

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