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The FPA-5510iV has a 2:1 reduction Projection Lens and a low Numerical Aperture, providing a wide-field exposure and a deep Depth of Focus
The FPA-5510iV Through-Silicon Alignment (TSA) option allows the stepper to perform infrared wafer frontside and backside alignment measurement of bonded wafers
The FPA-5510iV wafer handling and stage system options are designed to process severely warped and distorted wafers
The FPA-5510iV Resist Exhaust Outgas Unit option protects the lens from degradation due to thick-resist outgassing
The FPA-5510iV offers a variety of options originally developed for the 5500 Body Steppers that are designed to increase productivity and performance
Numerical Aperture (NA)
≤300 nm (|m| + 3σ) backside (option)
† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.