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FPA-5520iV Stepper


Nanoimprint Lithography

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FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]

FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome

  • FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates

  • FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance

  • FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity

FPA-5520iV is a high performance i-line stepper

  • FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers*

  • FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers

  • FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as 20%**

FPA-5520iV inherits the benefits proven by the FPA-5510iV

  • FPA-5520iV steppers inherit the proven high-resolution projection lens of the FPA-5510iV stepper

  • FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance

  • FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion

* Among same-class i-line steppers. As of July 4, 2016, based on a Canon survey

** Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

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Model Type

i-Line (365 nm) Stepper

Wafer Size

300 mm


≤ 1.0 µm

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio


Field Size

52 mm x 34 mm

Overlay Accuracy

≤150 nm (|m| + 3σ)

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

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