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FPA-5550iZ Stepper

Steppers

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Features

  • The FPA-5550iZ boasts 50% higher throughput when compared with the previous model, the FPA-5510iZ, by utilizing a high-acceleration stage that shortens wafer exposure time, optimized wafer feed time and improved alignment accuracy.

  • The FPA-5550iZ integrates Canon FPA-5500 series technologies and offers the high throughput for 300 mm wafers that is required in today's Mega-Fabs.

  • The FPA-5550iZ series provides an option for Standard Mechanical Interface (SMIF) usage, as do the FPA-6000 series tools. Utilizing SMIF systems allows significant productivity by automated reticle feeders while meeting mini-environmental requirements.

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Specifications

Model Type

i-Line (365 nm) Stepper

Wafer Size

300 mm; 200 mm

Resolution

≤0.35 µm *Conventional
≤0.28 µm *Annular

Numerical Aperture (NA)

0.45 ~ 0.57

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio

4:1

Field Size

26 mm x 33 mm

Overlay Accuracy

≤18 nm (|m| + 3σ)

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

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