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The FPA-5550iZ boasts 50% higher throughput when compared with the previous model, the FPA-5510iZ, by utilizing a high-acceleration stage that shortens wafer exposure time, optimized wafer feed time and improved alignment accuracy.
The FPA-5550iZ integrates Canon FPA-5500 series technologies and offers the high throughput for 300 mm wafers that is required in today's Mega-fabs.
The FPA-5550iZ series provides an option for Standard Mechanical Interface (SMIF) usage, as do the FPA-6000 series tools. Utilizing SMIF systems allows significant productivity by automated reticle feeders while meeting mini-environmental requirements.
≤0.28 µm *Annular
Numerical Aperture (NA)
† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.