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FeaturesFPA-5520iV HR Option achieves resolution of 0.8μm to support the advanced packaging process
In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, “FPA-5520iV HR option” has been released since December 2018
The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8μm, the finest resolution available in packaging-oriented lithography systems*
FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome
FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates
FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance
FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity
FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers**
FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers
FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as 20%***
FPA-5520iV steppers inherit the proven high-resolution projection lens of the FPA-5510iV stepper
FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance
FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion
* Among same-class i-line steppers. With flatness equal to Si wafer. As of December 10, 2018. Based on a Canon survey.
** Among same-class i-line steppers. As of July 4, 2016, based on a Canon survey
*** Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose
Related Papers at Technical Conferences
Sub-micron RDL patterning for Advanced Packaging
Presented at the 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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FPA-5520iV HR Option: ≤ 0.8µm
† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.