Web Content Viewer


FPA-5520iV / FPA-5520iV HR Option Stepper


Glowing Earth on dark background

For more information, click to download the Product Catalog.

FPA 6000es6a DUV Scanner

Canon Certified Product Optimization (CPO) Program

For inquiries, please contact us.

Contact Us


FPA-5520iV HR Option achieves resolution of 0.8μm to support the advanced packaging process
  • In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, “FPA-5520iV HR option” has been released since December 2018

  • The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8μm, the finest resolution available in packaging-oriented lithography systems*

FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]

FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome

  • FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates

  • FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance

  • FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity

FPA-5520iV is a high performance i-line stepper
  • FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers**

  • FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers

  • FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as 20%***

FPA-5520iV inherits the benefits proven by the FPA-5510iV
  • FPA-5520iV steppers inherit the proven high-resolution projection lens of the FPA-5510iV stepper

  • FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance

  • FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion

* Among same-class i-line steppers. With flatness equal to Si wafer. As of December 10, 2018. Based on a Canon survey.

** Among same-class i-line steppers. As of July 4, 2016, based on a Canon survey

*** Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

Related Papers at Technical Conferences

Sub-micron RDL patterning for Advanced Packaging

Presented at the 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Click here to download!

This is to make Misc appear on the page when needed.


Model Type

i-Line (365 nm) Stepper

Wafer Size

300 mm


FPA-5520iV: ≤ 1µm
FPA-5520iV HR Option: ≤ 0.8µm

Reticle Size

6 in. (0.25 in. thick)

Reduction Ratio


Field Size

52 mm x 34 mm

Overlay Accuracy

≤150 nm (|m| + 3σ)

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

 Return to Top