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EC7400 Electronic Component Production PVD Equipment
Product Highlights
Product Highlights- Equipped with cassette chamber and transfer chamber (C to C specification)
- Delivers excellent deposition uniformity
- Able to accommodate a variety of process modules according to application
- Provides high target utilization with rotary magnetron cathode
- Equipped with cassette chamber and transfer chamber (C to C specification)
- Delivers excellent deposition uniformity
- Able to accommodate a variety of process modules according to application
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EL3000 LED Production PVD Equipment
Product Highlights
- Batch processing of multiple wafers by tray transport is possible due to rotary deposition, which provides good deposition uniformity over a large area
- Fully automated operation (pumping, wafer transfer and deposition process)
- Provides high target utilization with rotary magnetron cathode
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FC7100 Metal Gate PVD Equipment
Product Highlights
Product Highlights- Capable of film composition control through ultrahigh vacuum co-sputtering
- Precise control of film thickness at sub-nanometer level
- Excellent uniformity (1σ < 1%).
- Low material cost through use of compact cathode
- Easy material changeover
- Capable of film composition control through ultrahigh vacuum co-sputtering
- Precise control of film thickness at sub-nanometer level
- Excellent uniformity (1σ < 1%).
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HC7100 HDD Sensor PVD Equipment
Product Highlights
Product HighlightsFeatures
- Offers excellent film thickness distribution of ±1 % or less with the use of LRP (Low Pressure Remote Plasma) sputtering technology
- Provides very flat and low resistance films with low pressure discharge at 0.02 Pa, which is an order of magnitude lower than conventional sputtering pressure
- Provides high MR ratio
- Extensive deposition module lineup
- Multi-cathode modules
Applications
- Magnetic read head production
- Offers excellent film thickness distribution of ±1 % or less with the use of LRP (Low Pressure Remote Plasma) sputtering technology
- Provides very flat and low resistance films with low pressure discharge at 0.02 Pa, which is an order of magnitude lower than conventional sputtering pressure
- Provides high MR ratio
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IC7500 Memory Wire PVD Equipment
Product Highlights
Product HighlightsFeatures
- Variable cathode magnet position (in 3D) using recipe, enabling easy optimization of film uniformity and target cleaning
- Provides world's highest standard throughput (80 wafers/hour)
- Provides > 90 % uptime in semiconductor memory production line
- Failure rate < 1 %
Applications
- Semiconductor memory (for metal wiring material) mass production
- Variable cathode magnet position (in 3D) using recipe, enabling easy optimization of film uniformity and target cleaning
- Provides world's highest standard throughput (80 wafers/hour)
- Provides > 90 % uptime in semiconductor memory production line
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ML3000 HDD Media PVD Equipment
Product Highlights
Product HighlightsFeatures
- Provides approximately twice the productivity (up to 1800 disks/hour) compared to competitive equipment
- Over ten days of continuous operation
- Flexible configuration enabling addition of chambers according to process needs
- Emphasis on vacuum quality to improve magnetic characteristics
- Provides high temperature heating and cooling unit for the development of next generation thermally assisted magnetic recording media
- 30 % space reduction compared to our previous product
Applications
- Mass production and development of next generation hard disk
- Provides approximately twice the productivity (up to 1800 disks/hour) compared to competitive equipment
- Over ten days of continuous operation
- Flexible configuration enabling addition of chambers according to process needs
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NC7900 MRAM PVD Equipment
Product Highlights
Product HighlightsFeatures
- Ultra high vacuum and oblique sputtering technology
- Excellent interfaces within the MTJ stack
- Compatible with planar & perpendicular MTJ deposition
- High throughput (25 wafers/h) with perpendicular MTJ stack process
Applications
- MRAM and STT-MRAM mass production
- Ultra high vacuum and oblique sputtering technology
- Excellent interfaces within the MTJ stack
- Compatible with planar & perpendicular MTJ deposition
$0.00Out Of Stock