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  1. FPA-3030EX6 Stepper

    Product Highlights

    FPA-3030EX6 KrF excimer laser steppers are designed for to support fabrication of analog chips, sensors and communication devices for IoT, high-bandwidth communication and power devices. The FPA-3030EX6 inherits the functionality of its predecessor, the FPA-3000EX6 (released in September 1999), while also offering compatibility with special substrates and functions used in the fabrication of a multitude of devices.

    As low as $0.00
  2. FPA-3030i5a Stepper

    Product Highlights

    FPA-3030i5a i-line Steppers provide low Cost-of-Ownership manufacturing for small substrates and are capable of imaging resolution below 0.35 microns while maintaining 40 nm overlay accuracy and high productivity. Canon developed the FPA-3030i5a to provide stable imaging, overlay and productivity for RF, Photonics, Sensor, Power, 5G Communication and MEMS applications.

    As low as $0.00
  3. FPA-3030iWa Stepper

    Product Highlights

    FPA-3030iWa steppers support small substrate processes using wafers 200 mm or less in diameter that are commonly used for fabricating devices related to 5G communication, power electronics and Internet-of-Things (IoT) devices including MEMS and CMOS Image sensors.

    As low as $0.00
  4. FPA-5520iV HR | LF | LF2 Stepper

    Product Highlights

    FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including through-silicon via, interposer and Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.

    The FPA-5520iV LF2 Option stepper allows even further advancement by supporting processes requiring submicron resolution across large exposure fields. For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF2 Option (Large-Field2) was developed to provide an 52 x 68 mm patterning in a single exposure.

    As low as $0.00
  5. FPA-5550iZ2 Stepper

    Product Highlights

    High-Productivity and High-Overlay Accuracy i-line Stepper for Low-CoO Fabrication

    FPA-5550iZ2 i-line Steppers offer a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication. FPA-5550iZ2 Steppers also support growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.

    The FPA-5550iZ2 offers a balance between productivity and alignment accuracy. Throughput upgrades include calibration, alignment, exposure & wafer transfer sequence optimization, and reduced wafer lot exchange times. Overlay matching can also be improved through shot-specific intra-field compensation.

    As low as $0.00
  6. FPA-6300ES6a

    Product Highlights

    The FPA-6300ES6a KrF single-stage lithography system is designed for the mass production of Dynamic Random Access Memory (DRAM), flash and other memory devices; logic devices such as microprocessors for personal computers; color filters and other imaging sensors and image-processing devices.

     

    Based on technologies cultivated through the field-proven FPA-6000 series, Canon's FPA-6300ES6a DUV scanner achieves high throughput and high overlay accuracy to effectively respond to the advanced needs of chip manufacturers seeking reduced cost of ownership.

    As low as $0.00
  7. FPA-6300ESW

    Product Highlights

    FPA-6300ESW wide-field DUV Scanners are capable of 130 nm resolution across a large exposure area for Single-Exposure Large Device Fabrication.

    FPA-6300ESW Scanners adopt a unique 3.125X reduction projection lens to yield a large 33 x 42.2 mm field size for large device fabrication without stitching.  Originally designed to support CMOS Image Sensor and color filter production on 300 mm wafers, the ESW can be configured to support 300 mm wafer processes including Sensor, Advanced Packaging and Display manufacturing.

    As low as $0.00
  8. FPA-8000iW Stepper

    Product Highlights

    The FPA-8000iW i-line stepper is designed for advanced Panel-Level Packaging (PLP) applications is the first Canon Semiconductor Lithography system supporting manufacturing using large panel substrates.

    FPA-8000iW panel steppers employ proprietary projection optical systems designed to provide 1.0 μm resolution across a wide 52 x 68 mm exposure field. The FPA-8000iW helps enable PLP cost reduction and package scaling by providing high-productivity panel processing with a large exposure field and high resolution.

    As low as $0.00
  9. FPA-1200NZ2C Nanoimprint Stepper

    Product Highlights

    FPA-1200NZ2C nanoimprint steppers can provide ≤ 15 nanometer pattern resolution
    FPA-1200NZ2C systems utilize high-resolution imprint masks that can faithfully reproduce fine circuit patterns on the wafer. Nanoimprint Lithography (NIL) equipment forms patterns on wafers by pressing a mask containing circuit patterns into resist in an imprint process. FPA-1200NZ2C nanoimprint lithography systems support ≤ 15 nanometer processes and can offer benefits over traditional photolithography equipment that can be susceptible to optical distortion.
    As low as $0.00
  10. FPA-5550iX Stepper

    Product Highlights

    FPA-5550iX steppers provide large-field device imaging without stitching adjacent fields
    FPA-5550iX steppers adopt a high-NA, 1/2 reduction projection lens to deliver 0.5 um resolution across a large 50 mm x 50 mm exposure field. The FPA-5550iX is suitable for production of full-field image sensors and advanced augmented reality displays that are larger field than Front-End-Of-the-Line (FEOL) lithography exposure fields (26mm x 33mm) and FPA-5550iX steppers can help avoid pattern stitching of adjacent fields that can directly affect yield.
    As low as $0.00
  11. MS-001 Wafer Metrology System

    Product Highlights

    MS-001 is a high-precision wafer alignment measurement device for semiconductor lithography systems
    Canon’s MS-001 wafer metrology system is capable of measuring the position of hundreds of alignment marks on semiconductor wafers in advance of wafer patterning. Premeasuring the alignment mark positions can result in improved overlay accuracy and reduced alignment measurement time in the lithography process.
    The MS-001 allows the majority of alignment measurements to be performed in one batch process, outside of the lithography system. The productivity of the lithography system can be improved by reducing the number of measurements performed.
    As low as $0.00
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kits and Refurbished products, you must complete the registration process directly in your account.
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kits and Refurbished products, you must complete the registration process directly in your account.