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  1. FPA-3030EX6 Stepper

    Product Highlights

    FPA-3030EX6 KrF excimer laser steppers are designed for to support fabrication of analog chips, sensors and communication devices for IoT, high-bandwidth communication and power devices. The FPA-3030EX6 inherits the functionality of its predecessor, the FPA-3000EX6 (released in September 1999), while also offering compatibility with special substrates and functions used in the fabrication of a multitude of devices.

    $999,999.00
    Out Of Stock
  2. FPA-3030i5a Stepper

    Product Highlights

    FPA-3030i5a i-line Steppers provide low Cost-of-Ownership manufacturing for small substrates and are capable of imaging resolution below 0.35 microns while maintaining 40 nm overlay accuracy and high productivity. Canon developed the FPA-3030i5a to provide stable imaging, overlay and productivity for RF, Photonics, Sensor, Power, 5G Communication and MEMS applications.

    $0.00
    Out Of Stock
  3. FPA-3030iWa Stepper

    Product Highlights

    FPA-3030iWa steppers support small substrate processes using wafers 200 mm or less in diameter that are commonly used for fabricating devices related to 5G communication, power electronics and Internet-of-Things (IoT) devices including MEMS and CMOS Image sensors.

    $0.00
    Out Of Stock
  4. FPA-5510iX Stepper

    Product Highlights

    FPA-5510iX steppers provide large-field device imaging without stitching adjacent fields

    FPA-5510iX steppers adopt a high-NA, 1/2 reduction projection lens to deliver 0.5 um resolution across a large 50 mm x 50 mm exposure field. The FPA-5510iX is suitable for products requiring large field exposure such as *MEMS devices and image sensors that can require a larger field than Front-End-Of-the-Line (FEOL) lithography exposure area (26mm x 33mm) and can avoid pattern **stitching that is disadvantageous from the viewpoint of image quality & productivity. The ability to expose large fields in a single exposure provides the FPA-5510iX with a big advantage.

    *MEMS: "Micro Electro Mechanical Systems" or MEMS are devices with a micron level mechanical structures that integrate sensors, actuators and electronic circuits.

    **Stitching exposure: A method of increasing exposure field size by connecting two or more adjacent exposure regions. The positional accuracy and alignment of the adjacent exposure regions directly affects the yield.

    $0.00
    Out Of Stock
  5. FPA-5520iV / HR Option / LF Option Stepper

    Product Highlights

    FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.

    The FPA-5520iV HR Option (High-Resolution) allows even further advancement by supporting processes requiring submicron resolution.

    For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF Option (Large-Field) was developed to provide an 52 x 68 mm exposure field in a single exposure.

    $0.00
    Out Of Stock
  6. FPA-5550iZ2 Stepper

    Product Highlights

    High-Productivity and High-Overlay Accuracy i-line Stepper for Low-CoO Fabrication

    FPA-5550iZ2 i-line Steppers offer a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication. FPA-5550iZ2 Steppers also support growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.

    The FPA-5550iZ2 offers a balance between productivity and alignment accuracy. Throughput upgrades include calibration, alignment, exposure & wafer transfer sequence optimization, and reduced wafer lot exchange times. Overlay matching can also be improved through shot-specific intra-field compensation.

    $0.00
    Out Of Stock
  7. FPA-6300ES6a

    Product Highlights

    The FPA-6300ES6a KrF single-stage lithography system is designed for the mass production of Dynamic Random Access Memory (DRAM), flash and other memory devices; logic devices such as microprocessors for personal computers; color filters and other imaging sensors and image-processing devices.

     

    Based on technologies cultivated through the field-proven FPA-6000 series, Canon's FPA-6300ES6a DUV scanner achieves high throughput and high overlay accuracy to effectively respond to the advanced needs of chip manufacturers seeking reduced cost of ownership.

    $0.00
    Out Of Stock
  8. FPA-6300ESW

    Product Highlights

    FPA-6300ESW wide-field DUV Scanners are capable of 130 nm resolution across a large exposure area for Single-Exposure Large Device Fabrication.

    FPA-6300ESW Scanners adopt a unique 3.125X reduction projection lens to yield a large 33 x 42.2 mm field size for large device fabrication without stitching.  Originally designed to support CMOS Image Sensor and color filter production on 300 mm wafers, the ESW can be configured to support 300 mm wafer processes including Sensor, Advanced Packaging and Display manufacturing.

    $0.00
    Out Of Stock
  9. FPA-8000iW Stepper

    Product Highlights

    The FPA-8000iW i-line stepper is designed for advanced Panel-Level Packaging (PLP) applications is the first Canon Semiconductor Lithography system supporting manufacturing using large panel substrates.

    FPA-8000iW panel steppers employ proprietary projection optical systems designed to provide 1.0 μm resolution across a wide 52 x 68 mm exposure field. The FPA-8000iW helps enable PLP cost reduction and package scaling by providing high-productivity panel processing with a large exposure field and high resolution.

    $0.00
    Out Of Stock