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  1. FPA-5520iV / HR Option / LF Option Stepper

    Product Highlights

    FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.

    The FPA-5520iV HR Option (High-Resolution) allows even further advancement by supporting processes requiring submicron resolution.

    For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF Option (Large-Field) was developed to provide an 52 x 68 mm exposure field in a single exposure.

    $0.00
    Out Of Stock
  2. FPA-8000iW Stepper

    Product Highlights

    The FPA-8000iW i-line stepper is designed for advanced Panel-Level Packaging (PLP) applications is the first Canon Semiconductor Lithography system supporting manufacturing using large panel substrates.

    FPA-8000iW panel steppers employ proprietary projection optical systems designed to provide 1.0 μm resolution across a wide 52 x 68 mm exposure field. The FPA-8000iW helps enable PLP cost reduction and package scaling by providing high-productivity panel processing with a large exposure field and high resolution.

    $0.00
    Out Of Stock