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  1. FPA-5520iV HR | LF | LF2 Stepper

    Product Highlights

    FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including through-silicon via, interposer and Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.

    The FPA-5520iV LF2 Option stepper allows even further advancement by supporting processes requiring submicron resolution across large exposure fields. For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF2 Option (Large-Field2) was developed to provide an 52 x 68 mm patterning in a single exposure.

    As low as $0.00
  2. FPA-8000iW Stepper

    Product Highlights

    The FPA-8000iW i-line stepper is designed for advanced Panel-Level Packaging (PLP) applications is the first Canon Semiconductor Lithography system supporting manufacturing using large panel substrates.

    FPA-8000iW panel steppers employ proprietary projection optical systems designed to provide 1.0 μm resolution across a wide 52 x 68 mm exposure field. The FPA-8000iW helps enable PLP cost reduction and package scaling by providing high-productivity panel processing with a large exposure field and high resolution.

    As low as $0.00
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kits and Refurbished products, you must complete the registration process directly in your account.
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kits and Refurbished products, you must complete the registration process directly in your account.