FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.
The FPA-5520iV HR Option (High-Resolution) allows even further advancement by supporting processes requiring submicron resolution.
For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF Option (Large-Field) was developed to provide an 52 x 68 mm exposure field in a single exposure.$0.00Out Of Stock
The FPA-8000iW i-line stepper is designed for advanced Panel-Level Packaging (PLP) applications is the first Canon Semiconductor Lithography system supporting manufacturing using large panel substrates.
FPA-8000iW panel steppers employ proprietary projection optical systems designed to provide 1.0 μm resolution across a wide 52 x 68 mm exposure field. The FPA-8000iW helps enable PLP cost reduction and package scaling by providing high-productivity panel processing with a large exposure field and high resolution.$0.00Out Of Stock