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  1. FPA-3030i5a Stepper

    Product Highlights

    FPA-3030i5a i-line Steppers provide low Cost-of-Ownership manufacturing for small substrates and are capable of imaging resolution below 0.35 microns while maintaining 40 nm overlay accuracy and high productivity. Canon developed the FPA-3030i5a to provide stable imaging, overlay and productivity for RF, Photonics, Sensor, Power, 5G Communication and MEMS applications.

    $0.00
    Out Of Stock
  2. FPA-3030iWa Stepper

    Product Highlights

    FPA-3030iWa steppers support small substrate processes using wafers 200 mm or less in diameter that are commonly used for fabricating devices related to 5G communication, power electronics and Internet-of-Things (IoT) devices including MEMS and CMOS Image sensors.

    $0.00
    Out Of Stock
  3. FPA-5510iX Stepper

    Product Highlights

    FPA-5510iX steppers provide large-field device imaging without stitching adjacent fields

    FPA-5510iX steppers adopt a high-NA, 1/2 reduction projection lens to deliver 0.5 um resolution across a large 50 mm x 50 mm exposure field. The FPA-5510iX is suitable for products requiring large field exposure such as *MEMS devices and image sensors that can require a larger field than Front-End-Of-the-Line (FEOL) lithography exposure area (26mm x 33mm) and can avoid pattern **stitching that is disadvantageous from the viewpoint of image quality & productivity. The ability to expose large fields in a single exposure provides the FPA-5510iX with a big advantage.

    *MEMS: "Micro Electro Mechanical Systems" or MEMS are devices with a micron level mechanical structures that integrate sensors, actuators and electronic circuits.

    **Stitching exposure: A method of increasing exposure field size by connecting two or more adjacent exposure regions. The positional accuracy and alignment of the adjacent exposure regions directly affects the yield.

    $0.00
    Out Of Stock
  4. FPA-5550iZ2 Stepper

    Product Highlights

    High-Productivity and High-Overlay Accuracy i-line Stepper for Low-CoO Fabrication

    FPA-5550iZ2 i-line Steppers offer a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication. FPA-5550iZ2 Steppers also support growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.

    The FPA-5550iZ2 offers a balance between productivity and alignment accuracy. Throughput upgrades include calibration, alignment, exposure & wafer transfer sequence optimization, and reduced wafer lot exchange times. Overlay matching can also be improved through shot-specific intra-field compensation.

    $0.00
    Out Of Stock