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  1. FPA-3030i5a Stepper

    Product Highlights

    FPA-3030i5a i-line Steppers provide low Cost-of-Ownership manufacturing for small substrates and are capable of imaging resolution below 0.35 microns while maintaining 40 nm overlay accuracy and high productivity. Canon developed the FPA-3030i5a to provide stable imaging, overlay and productivity for RF, Photonics, Sensor, Power, 5G Communication and MEMS applications.

    As low as $0.00
    Out Of Stock
  2. FPA-3030iWa Stepper

    Product Highlights

    FPA-3030iWa steppers support small substrate processes using wafers 200 mm or less in diameter that are commonly used for fabricating devices related to 5G communication, power electronics and Internet-of-Things (IoT) devices including MEMS and CMOS Image sensors.

    As low as $0.00
    Out Of Stock
  3. FPA-5510iX Stepper

    Product Highlights

    FPA-5510iX steppers provide large-field device imaging without stitching adjacent fields

    FPA-5510iX steppers adopt a high-NA, 1/2 reduction projection lens to deliver 0.5 um resolution across a large 50 mm x 50 mm exposure field. The FPA-5510iX is suitable for products requiring large field exposure such as *MEMS devices and image sensors that can require a larger field than Front-End-Of-the-Line (FEOL) lithography exposure area (26mm x 33mm) and can avoid pattern **stitching that is disadvantageous from the viewpoint of image quality & productivity. The ability to expose large fields in a single exposure provides the FPA-5510iX with a big advantage.

    *MEMS: "Micro Electro Mechanical Systems" or MEMS are devices with a micron level mechanical structures that integrate sensors, actuators and electronic circuits.

    **Stitching exposure: A method of increasing exposure field size by connecting two or more adjacent exposure regions. The positional accuracy and alignment of the adjacent exposure regions directly affects the yield.

    As low as $0.00
    Out Of Stock
  4. FPA-5550iZ2 Stepper

    Product Highlights

    High-Productivity and High-Overlay Accuracy i-line Stepper for Low-CoO Fabrication

    FPA-5550iZ2 i-line Steppers offer a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication. FPA-5550iZ2 Steppers also support growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.

    The FPA-5550iZ2 offers a balance between productivity and alignment accuracy. Throughput upgrades include calibration, alignment, exposure & wafer transfer sequence optimization, and reduced wafer lot exchange times. Overlay matching can also be improved through shot-specific intra-field compensation.

    As low as $0.00
    Out Of Stock
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kit products, you must complete the registration process directly in your account.
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kit products, you must complete the registration process directly in your account.