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  1. FPA-5550iX Stepper

    Product Highlights

    FPA-5550iX steppers provide large-field device imaging without stitching adjacent fields
    FPA-5550iX steppers adopt a high-NA, 1/2 reduction projection lens to deliver 0.5 um resolution across a large 50 mm x 50 mm exposure field. The FPA-5550iX is suitable for production of full-field image sensors and advanced augmented reality displays that are larger field than Front-End-Of-the-Line (FEOL) lithography exposure fields (26mm x 33mm) and FPA-5550iX steppers can help avoid pattern stitching of adjacent fields that can directly affect yield.
    As low as $0.00
  2. MS-001 Wafer Metrology System

    Product Highlights

    MS-001 is a high-precision wafer alignment measurement device for semiconductor lithography systems
    Canon’s MS-001 wafer metrology system is capable of measuring the position of hundreds of alignment marks on semiconductor wafers in advance of wafer patterning. Premeasuring the alignment mark positions can result in improved overlay accuracy and reduced alignment measurement time in the lithography process.
    The MS-001 allows the majority of alignment measurements to be performed in one batch process, outside of the lithography system. The productivity of the lithography system can be improved by reducing the number of measurements performed.
    As low as $0.00
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kit products, you must complete the registration process directly in your account.
If you have a MyCanon Account, your product and CarePAK will be registered using the profile details you provided. For Kit products, you must complete the registration process directly in your account.