FPA-3030iWa steppers support small substrate processes using wafers 200 mm or less in diameter that are commonly used for fabricating devices related to 5G communication, power electronics and Internet-of-Things (IoT) devices including MEMS and CMOS Image sensors.
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FPA-3030iWa processes ≤ 200 mm diameter substrates
- FPA-3030iWa can be configured to handle substrate diameters from 50 mm (2 inch) to 200 mm (8 inch) to support a variety of different wafer materials
- Large exposure field minimizes exposure stitching for large device production
Supports a wide range of manufacturing processes
- 52 x 52 mm wide-field projection lens with a variable numerical aperture (NA) ranging from 0.16 to 0.24
- Large depth of focus (DOF) allows uniformity patterning of submicron features
Compatible with a variety of different wafer sizes and materials
- Wafer feeder options support warped and transparent substrate processes using sapphire, silicon carbide and gallium nitride wafers
Off-axis alignment scope provides overlay process robustness
- FPA-3030iWa employs an off-axis alignment scope that measures wafer alignment marks through an off-axis optical path
- Off-axis alignment system allows use of a wide range of alignment illumination wavelengths to help optimize alignment process performance
- Simultaneous X & Y alignment mark measurement is available to increase stepper productivity
View Full Technical Specs PDF
Main Unit Specs