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FPA-5550iZ2 Stepper

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High-Productivity and High-Overlay Accuracy i-line Stepper for Low-CoO Fabrication

FPA-5550iZ2 i-line Steppers offer a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication. FPA-5550iZ2 Steppers also support growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.

The FPA-5550iZ2 offers a balance between productivity and alignment accuracy. Throughput upgrades include calibration, alignment, exposure & wafer transfer sequence optimization, and reduced wafer lot exchange times. Overlay matching can also be improved through shot-specific intra-field compensation.

Technical Specifications

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Main Unit Specs