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FPA-6300ESW wide-field DUV Scanners are capable of 130 nm resolution across a large exposure area for Single-Exposure Large Device Fabrication.

FPA-6300ESW Scanners adopt a unique 3.125X reduction projection lens to yield a large 33 x 42.2 mm field size for large device fabrication without stitching.  Originally designed to support CMOS Image Sensor and color filter production on 300 mm wafers, the ESW can be configured to support 300 mm wafer processes including Sensor, Advanced Packaging and Display manufacturing.

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