MELVILLE, NY, July 7, 2020 – Canon U.S.A., Inc. today
announced that its parent company, Canon Inc., expects to commence sales in early July 2020 of the
FPA-8000iW i-line stepper1, a new Semiconductor Lithography System
for advanced chip packaging. This system combines fine 1 μm2 resolution
with support for customer’s large panel substrates with sizes up to 515 x 510
This new product
marks the first Canon Semiconductor Lithography system to support manufacturing
using large panels that are common in back-end processing. Integrating a Canon
proprietary projection optical system, the FPA-8000iW offers a wide exposure
field and fine 1 μm pattern resolution. The FPA-8000iW was designed to meet the
needs of manufacturers who are aiming for high-production efficiency by using
515 x 510 mm organic (e.g., carbon based) panel substrates for Panel Level
Packaging (PLP) applications. PLP
processes typically involve mounting and processing a large number of
semiconductor chips on large, thin panels to produce packages that can help
increase communication bandwidth and reduce power consumption of high performance
Future customer requirements
for PLP processes include cost reduction and further shrinking of semiconductor
packaging that can help protect delicate internal semiconductor circuity from
outside environments and electrically connects to external components. The FPA-8000iW supports PLP cost reduction
and package scaling by providing high-productivity panel processing with a large
exposure field and high resolution.
In response to packaging processes
that use panel substrates, Canon developed this new FPA-8000 Body platform
capable of handling large 515 x 510 mm panel substrates. Severe warpage is also
common in large-panel substrates and the new platform and panel-feeding system
can overcome up to 10 mm of panel warpage.
As a result, the FPA-8000iW can help customers realize high-productivity
and efficiency for PLP production of large packages.
The FPA-8000iW stepper employs Canon’s
proprietary projection optical system that supports a wide 52 x 68 mm exposure
field while achieving 1.0 μm resolution, which is the finest resolution among lithography
systems that support large panel substrate processes3. As a result, advanced packaging technology
such as PLP can help customers innovate to provide high integration and
flexibility in electronic system design.
About Canon U.S.A., Inc.
Canon U.S.A., Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately $33 billion in global revenue, its parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S. patents granted in 2019† and was named one of Fortune Magazine's World's Most Admired Companies in 2020. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. To keep apprised of the latest news from Canon U.S.A., sign up for the Company's RSS news feed by visiting www.usa.canon.com/rss and follow us on Twitter @CanonUSA.
# # #
Based on weekly patent counts issued by United States Patent and Trademark
i-line stepper: A semiconductor lithography system that utilizes a 365 nm
wavelength mercury lamp as the light source. 1 nm (1 nanometer) = 1 billionth
of a meter
(1 micrometer) = one millionth of a meter = one thousandth of a millimeter
to Canon research and public third party data, as well as industry information as
of June 22nd, 2020
specifications are subject to change without notice.
product names, and other marks, are trademarks of their respective owners.