Canon Achieves World-First Novel Inkjet-based Wafer Planarization, Delivering Dramatically Smoother Wafer Surfaces

MELVILLE, N.Y., February 23, 2026 – Canon Inc., the parent company of Canon U.S.A., Inc., a leader in digital imaging solutions, announced that Canon has become the first in the world^Footnote1 to develop and practically implement a groundbreaking wafer planarization technology called inkjet-based adaptive planarization (IAP) by leveraging its expertise in nanoimprint lithography. Canon aims to commercialize equipment incorporating IAP technology in 2027 for use in advanced semiconductor manufacturing, including the manufacture of logic and memory devices.

Canon and Canon Nanotechnologies will be presenting their work on IAP at the upcoming SPIE Advanced Lithography and Patterning Conference scheduled for Wednesday, Feb. 25, at the San Jose Convention Center in San Jose, California. The presentation will include details on the IAP process and initial results.

To see the full release from Canon Inc., please visit here.

About Canon U.S.A., Inc.

Canon U.S.A., Inc. is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States, Latin America, and the Caribbean markets. With approximately $29.5 billion in global revenue, its parent company, Canon Inc., as of 2025 has ranked in the top-10 for U.S. patents granted for 42 consecutive years. ^Footnote2 Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. To learn more about Canon, visit www.usa.canon.com and connect with us on LinkedIn at www.linkedin.com/company/canonusa.

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