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Lithography Products
Based in San Jose, California, the Canon U.S.A. Industrial Products Division supplies i-line and Deep UV (DUV) lithography systems that are used in the fabrication and packaging of high-tech devices including integrated circuits, hard disk read/write heads, Microelectromechanical Systems (MEMS) devices, image sensors, displays, power devices and LEDs.
Canon photolithography equipment has also been developed to support the demands of Advanced Packaging, Through-Silicon Vias (TSV), Silicon Interposer and 3D Integration applications.
Canon has the resources and the commitment to develop ultra-precision imaging technologies and to find smarter ways to apply them to achieve the highest performance and value.
This smarter thinking is Enlightened Lithography–the unique Canon value that ensures the best return on our customers' investment.
For support, service and product inquiries, please contact semi-info@cusa.canon.com.
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Advanced Packaging is a growing area for many semiconductor manufacturing companies in the last decade. Learn about the challenges involved in Advanced Packaging and how the FPA-5520iV i-Line Stepper addresses them. General specifications are included as well.
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Responding to the demands of the market, Canon U.S.A.'s Product Optimization (CPO) Equipment Program offers benefits to customers seeking an all-inclusive used Canon legacy photolithography equipment solution. Read more about the equipment we support and the services we offer by clicking on the “Learn More” button below. Also, please send any questions you have on the following page.
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Learn about Canon Industrial Product Technology
Learn how Canon Nanoimprint Lithography can revolutionize the semiconductor industry.
Learn More >
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