FPA-5520iV HR | LF | LF2 Stepper
FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including through-silicon via, interposer and Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.
The FPA-5520iV LF2 Option stepper allows even further advancement by supporting processes requiring submicron resolution across large exposure fields. For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF2 Option (Large-Field2) was developed to provide an 52 x 68 mm patterning in a single exposure.
Terms
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Service
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Changes to Terms
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Overview
- FPA-5520iV LF2 Option contributes to 3D advanced packaging technologies with exposure fields of up to 100×100mm
- FPA-5520iV LF2 Option features a fine 0.8 µm resolution and a large 52 x 68 mm field size
- 4-shot exposure with minimal distortion to make possible a wide 100 × 100 mm exposure field
- LF2 option is designed to support mass production of large and dense packaging with fine circuit patterns that integrate 2.5D and 3D technology
- FPA-5520iV HR Option achieves 0.8 μm resolution to support advanced packaging processes
- HR Option employs a new projection optical system that achieves a resolution of 0.8 μm
- FPA-5520iV LF Option allows exposure of a large 52 x 68 mm field in a single shot
- LF Option for the projection optical system provides a single exposure with large field of 52 × 68 mm, which is more than 4 times the standard front-end exposure field (26 x 33 mm)
- LF options supports heterogeneous integration where multiple large semiconductor die and chiplets are interconnected
- FPA-5520iV addresses next-generation packaging production challenges including Fan-Out Wafer Level Packaging [FOWLP]
- FOWLP Wafers with severe warpage and die shift that must be processed
- Steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates
- Wafer stage adopts a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance
- Wafer handling options are available with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates
- Wide-field alignment scope can increase equipment utilization and productivity by making automatic wafer alignment possible when reconstituted wafers contain large amounts of die shift
Technical Specifications
View Full Technical Specs PDF
Main Unit Specs
FPA-5520iV HR Option ≤ 0.8 µm
FPA-5520iV LF Option ≤ 1.5 µm
FPA-5520iV LF2 Options ≤ 0.8 µm
FPA-5520iV HR Option ≤ 0.24～0.15 (Variable)
FPA-5520iV LF Option ≤ 0.24～0.15 (Variable)
FPA-5520iV LF2 Options ≤ 0.24～0.12 (Variable)
FPA-5520iV HR Option: 52 x 34 mm
FPA-5520iV LF Option: 52 x 68 mm
FPA-5520iV LF2 Options: 52 x 68 mm
FPA-5520iV HR Option: ≦ 0.15 µm
FPA-5520iV LF Option: ≦ 0.15 µm
FPA-5520iV LF2 Options: ≦ 0.10 µm