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FPA-5520iV HR | LF | LF2 Stepper

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FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including through-silicon via, interposer and Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.

The FPA-5520iV LF2 Option stepper allows even further advancement by supporting processes requiring submicron resolution across large exposure fields. For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF2 Option (Large-Field2) was developed to provide an 52 x 68 mm patterning in a single exposure.

Technical Specifications

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Main Unit Specs