FPA-5520iV / HR Option / LF Option Stepper


FPA-5520iV lithography systems were first introduced in 2016 and they continue to provide enable advanced packaging applications including Fan-Out Wafer Level Packaging (FOWLP) who are seeking higher performance and increased functionality and integration in electronic systems.

The FPA-5520iV HR Option (High-Resolution) allows even further advancement by supporting processes requiring submicron resolution.

For customers requiring large packages for very high-performance computing systems and heterogeneous integration of die and chiplets, the FPA-5520iV LF Option (Large-Field) was developed to provide an 52 x 68 mm exposure field in a single exposure.

Technical Specifications

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Main Unit Specs