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EC7400 Electronic Component Production PVD

Electronic Device Manufacturing

  • Equipped with cassette chamber and transfer chamber (C to C specification)
  • Delivers excellent deposition uniformity
  • Able to accommodate a variety of process modules according to application
    • Offset rotary sputtering module (multi-cathode specification)
    • Offset rotary and revolutionary sputtering module
    • Etching module for pre-cleaning
    • Preheating module
  • Provides high target utilization with rotary magnetron cathode

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  • System configuration: Cluster type (up to three process chambers)
  • Substrate: Up to Φ200 mm
  • Cathode: Φ7.1" cathode (Up to 4. Varies depending on the module.)
  • Available Modules: A variety of modules to choose from

This is to make Misc appear on the page when needed.

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

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