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EL3000 LED Production PVD

Electronic Device Manufacturing

  • Batch processing of multiple wafers by tray transport is possible due to rotary deposition, which provides good deposition uniformity over a large area
    • Φ2 inch wafer × 50 /batch
    • Φ3 inch wafer × 25 /batch
    • Φ4 inch wafer × 17 /batch
    • Φ6 inch wafer × 8 /batch
  • Fully automated operation (pumping, wafer transfer and deposition process)
  • Provides high target utilization with rotary magnetron cathode

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  • System configuration: Load lock type tray transport method
  • Substrate: Φ2 inch to Φ8 inch
  • Cathode: Up to four Φ7.1 inch or Φ12.5 inch

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† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

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