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NC7900 MRAM PVD

Semiconductor Device Manufacturing

  • Ultra high vacuum
  • Oblique angle PVD
  • Ultra-thin multilayer deposition
  • Fine interface control
  • Compatible with Planar & Perpendicular MTJ formation
  • Throughput of 25 wafers/h with perpendicular MTJ process is achieved

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  • System configuration: Cluster type
  • Substrate: Φ300 mm

This is to make Misc appear on the page when needed.

† Prices and specifications subject to change without notice. Actual prices are determined by individual dealers and may vary.

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